Mr. Kim(D2), Mr. Lin(D1) and Mr. Wakatsuki (M2) will give oral & poster presentations in AWPP2019
Mr. Kim (D2), Mr. Lin(D1) & Mr. Wakatsuki (M2) will give presentations in Asian workshop on polymer processing (AWPP2019, Beijing, China, Oct. 28th-31st).
“Electroless Plating on Polypropylene with Surface Modification by Polydopamine”, *Yuma Wakatsuki, Shinsuke Nagamine, Masahiro Ohshima (poster)
“Core-back foam injection molding of styrene-isobutylene-styrene copolymer (sibs) with N2 using polypropylene as a nucleating agent”, *Weiyuan Lin, Long Wang, Yuta Hikima, Masahiro Ohshima (poster)
“Preparation and characterization of poly(butylene succinate)(PBS)/poly(lactic acid)(PLA) foams using core-back foaming process”, *Dongho Kim, Long Wang, Yuta Hikima, Masahiro Ohshima (oral)