Department of Chemical Engineering,
Kyoto University

Particle Technology

Last Update: April 12, 2011

JAPANESE

INDEX

 Outline
 Research Topics
 Members of Laboratories
 Links to other WWW servers

OUTLINE

Research in this chair is focused on the analysis of phenomena in particle handling processes and on the development of the methods for the rational handling of them.  Particles are widely used in various fields and the particle behavior varies complicatedly depending on the conditions; thus, a full understanding is needed from the viewpoint of the effective application of fine particles and for environmental protection.  In particular, for dry powder systems, i) analysis of dynamic behavior of particles, ii) control of particle adhesion, and iii) evaluation of the total property including the effect of static electricity should be investigated.

RESEARCH TOPICS

o Electrification of particles

Tribo-electrification of particles is a fundamental phenomenon occurring in powder handling processes, and the electrostatic force acting on particles significantly affects the particle behavior.  Therefore, the control of the charging is important for powder handling.  In addition, applications using charged particles have been widely developed, e.g. electro-photography, dry powder coating, and electrostatic separation.  Since dispersion, agglomeration, and transport of charged particles can be remotely controlled using electrostatic force, the development of new applications is expected.  To realize it, a correct understanding of the particle charging, charge distribution control, particle movement control, and relevant online measurement techniques are required.

 (1) Clarification of the mechanism of particle charging in a steady electric field.
 (2) Control of the movement of charged particles under an unsteady electric field with spatial and temporal variation.
 (3) Analysis of the simultaneous transfer of mass and charge in a powder bed.
 (4) Development of a high-accuracy measurement system for charge distribution of fine particles.

o Evaluation of Adhesion and flowability of particles

Particle-particle and particle-wall interaction forces are important factors directly affecting powder handling, and it is required to develop appropriate methods for measuring adhesive property between primary particles and between aggregate particles, and for evaluating the flowability.

 (1) Analysis of adhesive strength distributions in various complex fields.
 (2) Analysis of flowability profiles.

o Mechanical handling of nano and submicron particles

To produce highly functional products, the demand for using nano and submicron particles is increasing every year.  Particle adhesiveness increases with decreasing particle diameter and powder handling becomes more difficult.  In particular, for small particles less than 1 m in diameter, the problems are serious, and it is urgent to develop new techniques, as well as to analyze of the particle behavior.

 (1) Development of micro-feeder for nanoparticles using a shear vibration.
 (2) Development of a system for particle dispersion using an ultrasonic vibration and airflow.
 (3) Development of a pneumatic transport system for nanoparticles.

MEMBERS of LABORATORY

o Staff

o Professor: Shuji MATSUSAKA
o Technical Expert: Masatoshi YASUDA
o Secretary: Harumi YOSHIMOTO

o Students

o Doctor course

Yi-Hung LIU
Takehiko HORIO

o Master course

Junpei IYOTA
Kentaro NISHIKAWA

Kohei SHIRAISHI
Yusuke FUJII
Dan WEI

o Under graduate

Kota KUBO
Megumi MIZUTANI

o Research student

 

2010-2011

o Post doctoral fellow

M. Imran Zainuddin

Other home pages related to powder technology

o Journal of the Society of Powder Technology, Japan
o The Information Center of Particle Technology, Japan
o The Association of Powder Process Industry and Engineering, Japan
o Powder Technology Lab. (Graduate School of Engineering･University of Hyogo)
o Thermal Fluid Engineering and Materials Processing Lab. (Hiroshima University)
o IMP

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For more information contact Shuji Matsusaka
E-mail : matsu@cheme.kyoto-u.ac.jp